Ibitayo, Investigation of post-etch copper residue on direct bonded copper (DBC) substrates. Ambat, Morphological study of silver corrosion in highly aggressive sulfur environments. Jung, Electrochemical migration behavior of silver nanopaste screen-printed for flexible and printable electronics. Harsányi, Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37. Kim, Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders. Ambat, Electrochemical migration on electronic chip resistors in chloride environments. Matsunawa, Electrochemical migration tests of solder alloys in pure water. Some candidate strategies for slowing down dendrite growth for tin and tin-based solder alloys have been elaborated. This work reviews briefly recent advances in method of inhibiting the ECM of tin and tin-based solder alloys. Some methods have been proposed to prevent the ECM behavior of tin-based solder alloys. Presently research effort to make clear the mechanism, kinetics, and effect of environmental factors on the ECM is the current focus of research and industrial community. Presence of moisture, ionic pollutants, bias condition, spacing between the adjacent conductors, and chemistry of electrolyte significantly affect ECM behavior. ECM can be divided into four basic steps: path formation, anodic dissolution, ion migration, and deposition of metal ions. This work opens a new avenue to develop advanced three-dimensional Zn metal anodes for high-performance rechargeable aqueous batteries.With the trend towards miniaturization and high density in electronics, electrochemical migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue, causing the occurrence of short circuit and resulting in huge damage. By contrast, the capacity of the cell with the anode decays to 55.2 mAh g−1 after 800 cycles, corresponding to a retention rate of 38.1%. Moreover, the anode enables the Zn-MnO2 full cell to deliver a high capacity of 164 mAh g−1 and maintain a retention rate of 86.2% after 1200 cycles at 1 A g−1. The cell with the pristine Cu mesh host (PCH), in comparison, exhibits a CE of 97.7% and suffers from short-circuits after 50 cycles. As a result, the asymmetric Zn\\NSH cell achieves a coulombic efficiency (CE) of 99.0% for over 200 cycles at 2 mA cm−2. ![]() Both experimental and numerical results reveal that the newly developed NSH offers abundant Zn nucleation sites, homogenizes both the ion flux and electric field at the electrode surface, and suppresses side reactions with the high hydrogen evolution reaction overpotential of Sn, thus leading to dendrite-free Zn deposition and a highly reversible plating/stripping process. To simultaneously address these issues, we create a hierarchical porous framework by electroless plating a conformal nanoporous tin (Sn) layer on a copper (Cu) mesh as a host (NSH) for the Zn anode. However, Zn anodes suffer from the dendrite formation and side reactions during the plating/stripping process, which severely hinder their practical applications. Metallic zinc (Zn), featuring high specific capacity, low redox potential, and low cost, is a promising anode material for next-generation rechargeable aqueous batteries. ![]() ![]() Please use this identifier to cite or link to this item: A hierarchical porous tin host for dendrite-free, highly reversible zinc anodes Bibliographic Details AuthorĬhemical Engineering Journal, v.
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